Diamond Sectioning / Wafering BladesCan be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others. These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate. |
The advantages are: - Faster cutting action – leaves smooth finish
- Less glazing – requires minimal dressing
- More universal – compatible with a greater variety of materials
All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" arbor holes. Three grades are offered to fit most applications: - LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete （ equivalent to Buehler 15LC）
- HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone （equivalent to Buehler 15HC）
- HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials （equivalent to Buehler 5LC and 10LC）
Prod # | Description | Unit | 1/2" Arbor Hole for Buehler, Struers, Allied and many others | 812-310 | Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/fine grit - low concentration | each | 812-311 | Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/coarse grit - high concentration | each | 812-312 | Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, fine grit - high concentration | each | 812-315 | Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration | each | 812-316 | Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration | each | 812-317 | Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration | each | 812-320 | Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration | each | 812-321 | Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration | each | 812-324 | Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration | each | 812-325 | Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration | each | 812-326 | Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration | each | 812-327 | Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration | each | 5/8" Arbor Hole for PELCO XP-300, PELCO CS600A and PCS-400 | 812-316-5 | Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration | each | 812-317-5 | Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration | each | 812-326-5 | Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/coarse grit - high concentration |
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