16047PELCO高效银导电胶

 PELCO® High Performance Silver Paste 高效银导电胶

高效银导电胶

PELCO® High Performance Silver Paste 高效银导电胶
置于无机硅酸盐溶液中的片状银粉专门为了满足以下一些情况下的粘合应用:

高温高至摄氏927度（华氏1700度）

高真空-无碳氢化合物,无挥发性有机化合物

低温（适宜性依匹配性能而定）

导热和导电性能，另外加上不含有碳氢化合物，使得该产品成为理想的扫描电镜、x射线光电子分光镜、化学分析电子光谱、次级离子质谱、钻孔机以及其他应用制作符合要求的样品的选择。PELCO高效银浆的银粒尺寸为20um，同时提供高效的热传导性和电导性。银含量超过60%。室温下可以固化，但是需要在摄氏93度（华氏200度）固化2小时以获得高的传导能力和强的粘附性。

PELCO® High Performance Silver Paste 高效银导电胶

The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for demanding specimen preparation in FESEM, XPS, ESCA, SIMS, Auger and other applications. PELCO^® High Performance Silver Paste provides both high and thermal conductivity with a silver particle size of 20µm. Silver content >60% by weight. Cures at room temperature, but requires a 2 hour cure at 93°C （200°F） to achieve high conductivity and strong bond. Must be fully cured before using this product at cryogenic temperatures. Soluble in water to 260°C （500°F）. Above this temperature it becomes almost insoluble.
PELCO® High Performance Silver Paste, 50g