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目录:赛默飞世尔科技(中国)有限公司>>FIB-SEM DualBeam>> Helios 5 Laser PFIB System

Helios 5 Laser PFIB System
  • Helios 5 Laser PFIB System
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参考价 面议
具体成交价以合同协议为准
  • 品牌 FEI/赛默飞
  • 型号
  • 厂商性质 生产商
  • 所在地 上海市
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更新时间:2025-07-30 07:00:22浏览次数:297评价

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Helios 5 Laser PFIB System
由于新 PFIB 色谱柱可实现 500 V Xe+ 最终抛光和所有操作条件下的优异性能,因此可以实现高质量、无镓 TEM 和 APT 样品制备。

Helios 5 Laser PFIB System

FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution

The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Key Features


Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.

Specifications

Femtosecond-laser specifications
Laser integration
  • Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.

Laser Output
First Harmonic
  • Wavelength

1030 nm (IR)


  • Pulse duration

<280 fs

Second Harmonic
  • Wavelength

515 nm (green)


  • Pulse duration

<300 fs

Optics
Coincident point
  • Working distance= 4 mm (Same as SEM/FIB)

Objective lens
  • Variable (motorized)

Polarization
  • Horizontal/vertical

Repetition rate
  • 1 kHz – 1 MHz

Position accuracy
  • <250 nm

Protective shutter
  • Automated SEM/PFIB protective shutter

Software
  • Laser control software

  • Laser 3D serial sectioning workflow

  • Laser 3D serial sectioning workflow with EBSD

  • Laser scripting with optional Thermo Scientific AutoScript 4 Software

Safety
  • Interlocked laser enclosure (Class 1 laser safety)


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