821-7Wafer-Mount559 Mounting Adhesive安装胶

Wafer-Mount™ 559 Mounting Adhesive

Specifications

Application Procedures:

1. Cut the Wafer-Mount™ sheet to the desired shape and size and peel the clear plastic tape away from the backing paper. Place the substrate, face down, over the part. Press firmly to assure good adhesion, then peel off the backing paper.
2. Process the substrate as required, then remove parts by heating in a well ventilated area to 300°F for 2-3 minutes until the adhesive softens. Use a tool to slide the substrate off the mounting plate.
3. Clean with acetone or MEK.
4. 将Wafer-Mount™板切割成所需的形状和尺寸，并将透明塑料带从背纸上剥离。 将基材面朝下放在零件上。 用力按压以确保良好的附着力，然后剥离背纸。
   根据需要处理基材，然后通过在通风良好的区域中加热至300°F，移除部件2-3分钟直至粘合剂软化。 使用工具将基板从安装板上滑下。
   用丙酮或MEK清洁。

   Prod #	Description	Unit

   821-7

   Wafer-Mount™ 559 Mounting Adhesive

   pkg/2

Wafer-Mount™ 559 Mounting Adhesive