16028Epoxy Bond 110环氧树脂粘合剂

Epoxy Bond 110环氧树脂粘合剂

Epoxy Bond 110 is a very low viscosity, hard and fast-curing epoxy with excellent bonding characteristics. A unique feature of is the red color that appears on curing. Cure by color instead of time. It is a reactive system only when heat is applied. It has good adhesion to many materials including metals, ceramics, glass and most plastics. Use for IC Cover Slip Technique when IC does not have passivation layer, when rounding occurs during cross-sectioning, or for in semiconductor field bond pad protection.

环氧树脂粘合剂110是一种粘度非常低，坚硬且快速固化的环氧树脂，具有优异的粘合特性。 一个*的特征是在固化时出现的红色。 用颜色而不是时间来治疗。 只有在施加热量时它才是反应系统。 它对许多材料具有良好的附着力，包括金属，陶瓷，玻璃和大多数塑料。 当IC没有钝化层，在横截面期间发生倒圆或半导体场焊盘保护时，用于IC盖板滑动技术。