16057PELCO®高温碳膏

PELCO® High Temperature Carbon Paste高温碳膏

The PELCO^® High Temperature Carbon Paste is aimed for applications where a conductive cement is needed which withstand temperatures up to 2000°C （3632°F）.This paste is ideally suited for mounting specimens on hot stages for SEM , FESEM, XPS, ESCA, SIMS and AUGER systems. Also for applications where silver migration or a reaction with silver or nickel flakes could be a problem, this product would be an excellent alternative. Carbon content is 50-60% by weight in an inorganic silicate aqueous solution. Conductivity in cured state is 4.6 ohm/square/mil. Must be fully cured to achieve good conductivity and strong bond. Soluble in water to 260°C （500°F）. Cure schedule is: air dry at room temperature for 2-4 hours, step cure at 93°C （200°F） and final cure at 260°C （500°F）.

PELCO®高温碳浆适用于需要耐高温2000°C（3632°F）的导电水泥的应用。该浆料非常适合在热台上安装样品，用于SEM，FESEM，XPS，ESCA ，SIMS和AUGER系统。 对于银迁移或与银或镍片反应可能成为问题的应用，该产品将是一个很好的选择。 在无机硅酸盐水溶液中碳含量为50-60重量％。 固化状态下的导电率为4.6欧姆/平方/密耳。 必须*固化才能达到良好的导电性和强粘结性。 溶于水至260°C（500°F）。 固化时间表：在室温下风干2-4小时，在93°C（200°F）下逐步固化，在260°C（500°F）下终固化。