洛氏硬度测试方法和原理/双语

洛氏硬度测试

ISO 6508 & ASTM E-18中将洛氏硬度测试定义为世界上使用广泛的硬度测试方法，适用于几乎所有的金属，在某种程度上同样适用于塑料。洛氏硬度测试是测量由特定压头和某个特定试验力所产生的永恒深度得来。洛氏硬度测试需要更少的式样表面准备工作，这使得测试更快速简便，因此在很多行业都得到广泛使用。洛氏硬度测试的主要优势在于其测试速度，打完压痕后就能立即显示测量结果。

洛氏硬度测试的基本方法为：首先施加一个初试验力，然后再施加一个主试验力来达到所需的总的力值，最后回到初试验力。初试验力标定了零点或参考点。施加主试验力保持一定预设时间是为了使弹性复原。然后移除主试验力，而仍然保留初试验力来得出相对零点或参考点所发生的变化，以至于得出洛氏硬度值。

轶诺的NEXUS, VERZUS, NEMESIS和Fenix200CL系列的硬度计均由力传感器闭环控制（下一篇文章将重点介绍）；它们均由轶诺的研发中心所研发，设计，并完成耐久测试。此外，所有电路板和高科技组件由内部生产以确保高等级的行业生产质量控制。

ROCKWELL HARDNESS TESTER

The Rockwell hardness tester uses the method as defined in ISO 6508 & ASTM E18, which is the most commonly used method around the world to determine a material’s hardness and is suitable for almost all metals and to some degree for plastics. Rockwell test measures the permanent depth of indentation produced by a specified force/load on a specified indenter. The Rockwell test requires the least amount of sample prep making it the quicker and easier hardness test to perform across many industries around the globe. The main advantage of Rockwell hardness testing is its speed of testing and its ability to display hardness values directly after penetrating the material.

HOW IS A ROCKWELL HARDNESS TEST DETERMINED?

The Rockwell hardness is determined by the application of a preliminary test force (minor load or preload), followed by an additional load (major load) to reach the total required test load, finally returning to the same preliminary test force (minor load). The first minor load provides the zero or reference position. The major load is applied and held for a predetermined amount of time (dwell time) to allow for elastic recovery. Then the major load is removed, while still maintaining the minor load to establish the change from zero or refence position in determining a Rockwell hardness value.

The NEXUS, VERZUS, NEMESIS and Fenix 200CL series,  dedicated Rockwell hardness testers, are Load Cell Closed Loop machines developed, designed and endurance tested at INNOVATEST R&D facilities. In addition, all electronic boards and high-tech components are manufactured internally allowing the highest level of manufacturing quality control in our industry.