122-07 （SP）高导热环氧树脂模压粘合胶

122-07 （SP）高导热环氧树脂模压粘合胶
说明
122-07SP是一种丝网印刷，B-耐老化，高导热，单组分环氧涂层和粘合剂。
DESCRIPTION
122-07SP is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive.

122-07 (SP)高导热环氧树脂模压粘合胶

说明

122-07SP是一种丝网印刷，B-耐老化，高导热，单组分环氧涂层和粘合剂。

该系统具有优异的热稳定性、优异的耐化学性和优异的高温性能

财产。应用领域包括模压粘合剂、印刷电路板制造、高级材料

复合材料、密封和高性能涂层。

特色

优异的导热性优异的印刷适性

B-可分级屏幕寿命长

优异的耐化学性优异的高温性能

低离子

离子含量

氯化物<10ppm

钠<10ppm

钾<10ppm

（典型特性不用作规范限值）

典型未固化特性

财产价值单位

粘度-布鲁克菲尔德帽子粘度计

@25°C 23000 cps时为10转/分

比重1.85水=1

理论覆盖率@0.001“厚度1 30 in2

屏幕寿命8小时

固体87%

彩色腻子不适用

1取决于筛网和材料

典型固化性能

财产价值单位

导热系数5.5 w/mk

介电强度440伏/密耳

体积电阻率1 x 1016欧姆-厘米

介电常数5.2 1赫兹

介电系数0.018 60赫兹

热稳定性高达325摄氏度

有效温度范围-55至230摄氏度

玻璃化转变温度-TG 100摄氏度

热膨胀系数-低于TG 29.5 x 10-6 in/in/℃

-高于TG 13.5 x 10-5英寸/英寸/摄氏度

所有技术信息均基于CMI人员获得的数据，并被认为是可靠的。不

对于结果或可能侵犯的行为，保证是明示或暗示的。

修订日期：3/9/07修订版：C

典型固化性能

财产价值单位

动态拉伸模量-65°C 8780兆帕

25°C 6710兆帕

150°C 182兆帕

200°C 152兆帕

T-抗剪强度1800 psi

300°C时的体重减轻，TGA 2.98%

差示扫描量热法

峰值温度184°C

ΔHC-28.7焦耳/克

122-07（SP）热重分析

温度-℃

重量百分比（%）

固化指南

温度（摄氏度）时间（分钟）

150 60个

17530个

200 15个

搬运和储存

122-07（SP）是单组分环氧树脂系统，可在收到时使用。产品应冷藏至

保持*的流动特性。打开前让122-07（SP）预热至室温

集装箱。使用前，充分混合，重新悬浮填料。如果需要，122-07（SP）可以用

创作材料的数量'113-12稀薄。

保质期

储存温度容器B级薄膜

25°C 2个月1个月

-10°C 6个月6个月

这些温度和时间表示为

仅供参考。鼓励终用户

确定养护制度的试验。

所有技术信息均基于CMI人员获得的数据，并被认为是可靠的。不

对于结果或可能侵犯的行为，保证是明示或暗示的。

修订日期：3/9/07修订版：C

B阶段程序

在基材上涂上粘合剂。加热至非粘性阶段（冷却至室内时）提前固化

温度）。要求温度为125°C，持续2-3分钟（B级时间与质量有关）。用户是

鼓励在给定温度下试验干燥时间。存放在释放衬垫上以防止

污染。

粘合程序

若要使用，请小心对齐要粘合的零件，施加均匀的压力以保持位置。遵循固化指南

以上给出。胶粘剂和基材达到固化温度后，应开始计时。

健康与安全

在充分通风的情况下使用。远离火花和明火。避免长时间接触皮肤和

吸入蒸汽。用肥皂和水清洗以去除皮肤。

122-07 (SP)高导热环氧树脂模压粘合胶

 122-07 (SP)
HIGHLY THERMALLY CONDUCTIVE, EPOXY DIE ATTACH ADHESIVE
DESCRIPTION
122-07SP is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive.
This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature
properties. Applications include die attach adhesives, printed circuit board fabrication, advanced material
composites, sealing and high performance coatings.
UNIQUE FEATURES
 Excellent Thermal Conductivity  Outstanding Printability
 B-Stageable  Long Screen Life
 Excellent Chemical Resistance  Excellent High Temperature Performance
 Low Ionics
IONIC CONTENT
Chloride <10ppm
Sodium <10ppm
Potassium <10ppm
(Typical properties are not intended to be used as specification limits)
TYPICAL UNCURED PROPERTIES
Property Value Units
Viscosity – Brookfield HAT Viscometer
@ 10 rpm @ 25°C 23,000 cps
Specific Gravity 1.85 water = 1
Theoretical Coverage @ 0.001” Thickness1 30 in2
Screen Life 8 hrs
Solids 87 %
Color Putty N/A
1 Dependent on screen mesh and material
TYPICAL CURED PROPERTIES
Property Value Units
Thermal Conductivity 5.5 W/mK
Dielectric Strength 440 volts/mil
Volume Resistivity 1 x 1016 ohms - cm
Dielectric Constant 5.2 1 Hz
Dielectric Factor 0.018 60 Hz
Thermal Stability Good to 325 º C
Useful Temperature Range -55 to 230 º C
Glass transition Temperature – Tg 100 º C
Coefficient of Thermal Expansion - Below Tg 29.5 x 10-6 in/in/°C
 - Above Tg 13.5 x 10-5 in/in/°C
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 3/9/07 REVISION: C
TYPICAL CURED PROPERTIES
Property Value Units
Dynamic Tensile Modulus -65°C 8780 Mpa
 25°C 6710 Mpa
 150°C 182 Mpa
 200°C 152 Mpa
T-Shear Strength 1800 Psi
Weight Loss @ 300°C, TGA 2.98 %
Differential Scanning Calorimetry (DSC)
 Peak Tc 184 °C
 ∆ Hc -28.7 J/g
122-07(SP) TGA
Temperature - °C
Weight % (%)
CURING GUIDELINES
Temperature (ºC) Time (min.)
 150 60
 175 30
 200 15
HANDLING AND STORAGE
122-07(SP) is a one component epoxy system and is ready to use as received. Product should be stored frozen to
maintain consistent flow properties. Allow 122-07(SP) to warm up to room temperature before opening
container. Prior to using, mix thoroughly to re-suspend fillers. If needed, 122-07(SP) can be thinned with small
amounts of Creative Materials’ 113-12 thinner.
 SHELF LIFE
Storage Temperature Containers B-Staged Film
 25°C 2 months 1 month
-10°C 6 months 6 months
These temperatures and times are presented as a
guide only. The end-user is encouraged to
experiment to determine optimum curing schedule.
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 3/9/07 REVISION: C
B-STAGE PROCEDURE
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room
temperature). A temperature of 125°C for 2 – 3 minutes is required (B-stage time is mass related). The user is
encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent
contamination.
BONDING PROCEDURE
To use, carefully align parts to be bonded, apply uniform pressure to maintain location. Follow curing guidelines
given above. Timing should start once adhesive and substrate reach curing temperature.
HEALTH AND SAFETY
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and
breathing of vapors. Wash with soap and water to remove fro skin.