118-06可移印，B级，导电环氧粘合剂

118-06可移印，B级，导电环氧粘合剂

说明

118-06是一种可移印、B级可固化、导电、单组分环氧涂层和粘合剂。118-06罐

也可通过浸渍或注射器配药来使用。该系统具有良好的热稳定性，的

耐化学性和优异的高温性能。应用包括但不限于粘合

引线框架电容器，组装电气和电子元件。适用于较低

需要温度固化，按照以下说明使用创造性材料119-44固化剂。

特色

『优良的导电性』出色的印刷性

“B-可稳定”优异的高温性能

优异的耐化学性

典型未固化特性

财产价值单位

粘度-布鲁克菲尔德帽子粘度计

@25℃下10转/分11000 cps

比重2.49水=1

填料银不适用

银含量（固化）>70%

理论覆盖率@0.001“湿厚度24 in2

/克

固体84%

彩银不适用

典型固化性能

财产价值单位

工作温度-55至+230°C

峰值温度325°C

体积电阻率0.0008Ω-cm

玻璃化转变温度-TG 100摄氏度

热膨胀系数50 ppm/oC

T-抗剪强度2100 psi

300℃时体重减轻，TGA 2.77%

差示扫描量热法

温度168摄氏度

ΔHC-33.4焦耳/克

所有技术信息均基于CMI人员获得的数据，并被认为是可靠的。不

对于结果或可能侵犯的行为，保证是明示或暗示的。

搬运和储存

118-06是单组分环氧树脂系统，可在收到时使用。产品应冷藏至

保持*的流动特性。打开容器前，让118-06预热至室温。

使用前，充分混合，重新悬浮填料。如果需要，118-06可以用少量

创意材料113-39（快干）或114-20（慢干）稀释剂。

保质期

储存温度容器注射器B级薄膜

25摄氏度2个月不适用1个月

-10摄氏度6个月6个月3个月

CMI 119-44使用说明

按重量从119-44的1份添加到118-06的100份，并充分混合。

使用119-44的固化指南：80°C 4小时

100°C 2小时

这些温度和时间表示为

仅供参考。鼓励终用户

确定养护制度的试验。

所有技术信息均基于CMI人员获得的数据，并被认为是可靠的。不

对于结果或可能侵犯的行为，保证是明示或暗示的。

修订日期：5/22/07修订日期：E

B阶段程序

在基材上涂上粘合剂。加热至非粘性阶段（冷却至室内时）提前固化

温度）。需要125℃的温度2-3分钟（B级时间与质量有关）。用户是

鼓励在给定温度下试验干燥时间。存放在释放衬垫上以防止

污染。

粘合程序

若要使用，请小心对齐要粘合的零件，施加均匀的压力以保持位置。遵循固化指南

以上给出。胶粘剂和基材达到固化温度后，应开始计时。

细节

一。和所有的粘合剂一样，表面处理是整个过程中至关重要的一部分。仔细清洁两个

如有可能，表面应与MEK粘合。如果MEK与要粘合的表面不兼容，

可以使用另一种合适的溶剂。

2.使清洁后的表面*干燥。

三。模切118-06至接口区域尺寸，取下其中一个保护套，定位到

其中一个待粘合表面，并将基材/粘合剂加热至50°C-70°C。

四。通过施加轻微的压力，将薄膜/粘合剂层压到基底上，以消除任何滞留的空气。

让其冷却至室温并剥去另一个释放衬垫。

5个。放置另一个基板，并使用夹具提供恒定压力。

6.按照之前的指南进行治疗。

7号。消除压力。零件已准备好使用。

健康与安全

在充分通风的情况下使用。远离火花和明火。避免长时间接触皮肤和

吸入蒸汽。用肥皂和水清洗皮肤。

118-06可移印，B级，导电环氧粘合剂

 118-06
PAD PRINTABLE, B-STAGEABLE, ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE
DESCRIPTION
118-06 is a pad-printable, B-Stageable, electrically conductive, one part epoxy coating and adhesive. 118-06 can
also be applied by dipping or syringe dispensing. This system features excellent thermal stability, outstanding
chemical resistance and excellent high temperature properties. Applications include, but are not limited to bonding
capacitors to lead frames, assembling electrical and electronic components. For applications where a lower
temperature cure is required, use Creative Materials’ 119-44 curative per instructions below.
UNIQUE FEATURES
¯ Excellent Electrical Conductivity ¯ Outstanding Printability
¯ B-Stageable ¯ Excellent High Temperature Performance
¯ Excellent Chemical Resistance
TYPICAL UNCURED PROPERTIES
Property Value Units
Viscosity – Brookfield HAT Viscometer
@ 10 rpm @ 25ºC 11,000 cps
Specific Gravity 2.49 water = 1
Filler Silver N/A
Percent Silver (cured) >70 %
Theoretical Coverage @ 0.001” Wet Thickness 24 in2
/gram
Solids 84 %
Color Silver N/A
TYPICAL CURED PROPERTIES
Property Value Units
Operating Temperature -55 to +230 °C
Peak Temperature 325 °C
Volume Resistivity 0.0008 Ω - cm
Glass transition Temperature – Tg 100 ºC
Coefficient of Thermal Expansion 50 ppm/ºC
T-Shear Strength 2100 Psi
Weight Loss @ 300ºC, TGA 2.77 %
Differential Scanning Calorimetry (DSC)
 Peak Tc 168 ºC
 ∆ Hc -33.4 J/g
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
HANDLING AND STORAGE
118-06 is a one component epoxy system and is ready to use as received. Product should be stored frozen to
maintain consistent flow properties. Allow 118-06 to warm up to room temperature before opening container.
Prior to using, mix thoroughly to re-suspend fillers. If needed, 118-06 can be thinned with small amounts of
Creative Materials’ 113-39 (fast drying) or 114-20 (slow drying) thinners.
 SHELF LIFE
Storage Temperature Containers Syringes B-Staged Film
 25º C 2 months N/A 1 month
-10º C 6 months 6 months 3 months
INSTRUCTIONS FOR USE WITH CMI 119-44
Add 1 part of 119-44 to 100 parts of 118-06 by weight and mix thoroughly.
Curing guidelines using 119-44: 80° C 4 hours
100°C 2 hours
These temperatures and times are presented as a
guide only. The end-user is encouraged to
experiment to determine optimum curing schedule.
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 5/22/07 REVISION: E
B-STAGE PROCEDURE
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room
temperature). A temperature of 125º C for 2 – 3 minutes is required (B-stage time is mass related). The user is
encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent
contamination.
BONDING PROCEDURE
To use, carefully align parts to be bonded, apply uniform pressure to maintain location. Follow curing guidelines
given above. Timing should start once adhesive and substrate reach curing temperature.
Details
1. As with all adhesive bonds, surface preparation is a vital part of the process. Carefully clean both
surfaces to be bonded with MEK if possible. If MEK is not compatible with the surfaces to be bonded,
another suitable solvent may be used.
2. Allow cleaned surfaces to dry completely.
3. Die cut 118-06 to the of the size of interface area, remove one of the protective liners, position onto
one of the surfaces to be bonded, and warm the substrate/adhesive to 50°C-70°C.
4. By applying slight pressure, laminate the film/adhesive to the substrate smoothing out any trapped air.
Allow to cool to room temperature and peel off the other release liner.
5. Position the other substrate and apply a clamp to provide constant pressure.
6. Cure per previous guidelines.
7. Remove pressure. Part is ready for use.
HEALTH AND SAFETY
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and
breathing of vapors. Wash with soap and water to remove from skin.