125-26 Part A/ B119-44导电双组分环氧油墨

125-26 Part A/ B119-44导电双组分环氧油墨

说明：125-26是一种双组分耐溶剂导电油墨，适用于丝网印刷

具有细线宽和间距的电路。本产品与ITO涂层表面具有良好的附着力，

聚酰亚胺、聚酯、玻璃、聚碳酸酯等基材。这种产品对甲基乙基有很强的抵抗力

酮和其他腐蚀性溶剂。它也非常抗刮伤和折痕。一些应用程序

125-26包括但不限于触摸屏母线、太阳能电池网格线、聚酰亚胺的EMI/RFI屏蔽

柔性电路、聚合物厚膜电路和薄膜开关。本产品设计用于交叉路口

对于cmi产品116-20，紫外固化电介质或118-08，热固化电介质。125-26是

118-09A/B。

配合比（按重量计）：A部分B119-44

100 1.5分

适用期：4天。

混合说明：在加入固化剂之前，在原容器中预混料125-26 A部分。增加B119-44

搅拌均匀。此时，可通过添加少量CMI 113-12稀释剂来稀释材料。

典型固化特性：

稠度光滑膏

填充银

银含量（固化）>85

抗皱性佳

薄板电阻率（ohm/sq./mil）低至0.015（其他数据见下面的固化计划）

可焊性编号

水解稳定性优异

有效温度范围（摄氏度）-55至200

热稳定性（摄氏度）达到200

固化计划和导电性：

固化温度

（摄氏度）

可达到的固化时间电导率

（Ω/sq/mil）

100 1小时<0.060

150 30分钟<0.030

150 1小时<0.020

175 30分钟<0.020

175 1小时<0.015

注：固化时间是建议，建议客户试验在其应用中有效的方法。

储存：25°C下，未开封、未混合的容器中保存12个月。

安全和操作：在通风良好的情况下使用。远离火花和明火。避免长时间

接触皮肤和吸入蒸汽。用肥皂和水清洗皮肤。注：这并不罕见

使B部分结晶。在水浴中加热至40-45°C，使材料恢复原状

粘度。结晶不会以任何方式影响产品的性能。

125-26 Part A/ B119-44导电双组分环氧油墨

 125-26 Part A/ B119-44
ELECTRICALLY CONDUCTIVE, FINE LINE, TWO PART EPOXY INK
DESCRIPTION: 125-26 is a two component, solvent-resistant, electrically conductive ink suitable for screen-printing
circuits with fine line widths and spacing. This product features excellent adhesion to ITO coated surfaces,
polyimide, polyester, glass, polycarbonate and other substrates. This product is very resistant to methyl ethyl
ketone and other aggressive solvents. It is also very resistant to scratching and creasing. Some applications for
125-26 include, but are not limited to, touch screen bus bars, solar cell grid lines, emi/rfi shielding of polyimide
flexible circuits, polymer thick film circuitry, and membrane switches. This product is designed for use in crossovers
with CMI product 116-20, a UV curable dielectric or 118-08, a thermal cure dielectric. 125-26 is a fine line version of
118-09A/B.
MIX RATIO (by weight): Part A Part B119-44
100 1.5
Pot Life: 4 days.
MIXING INSTRUCTIONS: Premix 125-26 Part A, in original container prior to adding curing agent. Add B119-44
and mix until uniform. At this point the material may be thinned by adding small amounts of CMI 113-12 thinner.
TYPICAL CURED PROPERTIES:
Consistency Smooth Paste
Filler Silver
Percent Silver (cured) > 85
Crease Resistance Excellent
Sheet Resistivity (ohm/sq./mil) as low as 0.015 (See cure schedule below for additional data)
Solderable No
Hydrolytic Stability Excellent
Useful Temperature Range (°C) -55 to 200
Thermal Stability (°C) Good to 200
CURE SCHEDULE AND CONDUCTIVITY:
Cure Temperature
(°C)
Cure Time Conductivity Achievable
(Ω/sq/mil)
100 1 Hour < 0.060
150 30 Minutes < 0.030
150 1 Hour < 0.020
175 30 Minutes < 0.020
175 1 Hour < 0.015
Note: Cure times are suggestions and customers are advised to experiment for what works best in their application.
STORAGE: Shelf life: 12 months at 25°C, in unopened, unmixed containers.
SAFETY & HANDLING: Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged
contact with skin and breathing of vapors. Wash with soap and water to remove from skin. Note: It is not unusual
for crystallization of the Part B to occur. Warm to 40-45°C in a water bath to return the material to it's original
viscosity. The crystallization does not affect the performance of the product in any way.