光纤抛光片/二氧化硅抛光片

    产品特性(Product characteristics):

    二氧化硅抛光片，将0.02微米颗粒涂布于3mil精密PET带基上，作为光纤研磨终端抛光。
Silicon dioxide polishing wafer, the 0.02 micron particles are coated on the 3mil precision PET band, as the optical fiber polishing polishing terminal.

    产品规格：圆盘型: 直径127mm (5")

    长方型: 113mm X 140mm   

    使用基材：厚度为3mil(75um)聚酯薄膜

    Use of substrate: the thickness of 3mil (75um) polyester film.

    研磨工艺建议(Grinding process suggestion):

    研磨前应先将抛光片保持充份湿润, 并且保持研磨还境洁净，在每盘抛光完成后, 确实地清洗抛光片,可保持抛光片处于良好的抛光效能使抛光片得延长其使用寿命。

    Before grinding should first polishing pads to keep sufficient moist, and keep grinding environment clean, in after the completion of each disc polishing, actually cleaning polishing pad can keep polishing plate is in a good polishing performance enable polishing slice to prolong its service life.